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Last updated: September 2026
This directory lists 78 chip manufacturers private label across the United States, from specialized fabless design houses to vertically integrated IDMs offering white-label services.
Buyers engage private label chip manufacturers to solve critical problems such as achieving unique performance characteristics that off-the-shelf components cannot deliver, securing their supply chain against obsolescence, and protecting proprietary Intellectual Property (IP Core). This includes developing custom ASICs optimized for specific power envelopes or processing requirements, utilizing advanced process nodes for smaller die sizes, and ensuring robust backend-of-line (BEOL) processing for reliable packaging and integration.
Supplier types in this space vary significantly. Pure-play foundries specialize solely in wafer fabrication, working from customer-provided GDSII files. Fabless design houses offer complete design-to-silicon services, managing the foundry relationship on behalf of the buyer. Outsourced Semiconductor Assembly and Test (OSAT) providers focus on packaging, assembly, and final test, often partnering with foundries and design houses. Additionally, some Integrated Device Manufacturers (IDMs) leverage their excess capacity to offer private label manufacturing for specific product lines.
Before approaching suppliers, buyers should meticulously prepare detailed technical specifications, including functional requirements, electrical characteristics, environmental operating conditions, and anticipated volume forecasts. Suppliers, in turn, expect comprehensive design documentation, such as GDSII layout files or detailed Register-Transfer Level (RTL) code, robust test vectors for functional verification, and a clear understanding of the project's non-recurring engineering (NRE) budget and timeline expectations.
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78 companies nationwide
Amkor Technology is a US-based provider of advanced semiconductor packaging and test services. They offer comprehensive outsourced semiconductor assembly and test (OSAT) solutions for global chip manufacturers, supporting the production of integrated circuits.
ASIC North provides comprehensive Very Large Scale Integration (VLSI) development and custom ASIC design services for the semiconductor industry in the United States. The company offers verification, fabrication, characterization, qualification, and supply services, supporting clients from concept to finished goods delivery.
Atomica Corp. is a US-based MEMS foundry offering rapid prototyping and scalable production. They specialize in sensors, photonics, and biochips, providing advanced microfabrication capabilities. Atomica integrates complex layers and materials using photolithography, deposition, and etching, delivering high-performance, cost-efficient solutions.
Based in San Jose, CA, Ayar Labs develops unique optical I/O technology crucial for scaling next-generation silicon photonics-based architectures. The company specializes in providing advanced optical interconnect solutions to meet the demands of AI and high-performance computing chip manufacturers.
Chiparama provides end-to-end semiconductor and embedded engineering services, specializing in custom ASIC/SoC design from specification to GDSII silicon execution. They offer advanced verification and physical design, ensuring first-pass silicon success for diverse applications. The company leverages offshore talent with U.S.-based program management.
Based in Irvine, CA, Custom Silicon Solutions designs and supplies custom analog and mixed-signal ASICs, providing full turnkey capabilities from concept through production. They specialize in high-voltage, ultra-low power, precision analog, and wireless communication, serving industrial, medical, and aerospace systems.
Innovent Technologies provides semiconductor contract manufacturing services from its facilities in Peabody, MA. The company specializes in producing chips and related components for other manufacturers, supporting various applications within the electronics industry.
MEMSnet operates a class 10 foundry in the USA, providing comprehensive MEMS foundry services. Specializing in semiconductor manufacturing, the company offers scalable production for both large and small volumes, handling 6" and 4" wafers. It supports diverse applications for chip manufacturers seeking private label solutions.
Based in Centennial, CO, Micross AIT provides comprehensive in-house wafer bumping and Wafer-Level Chip Scale Package (WLCSP) solutions. The company specializes in state-of-the-art wafer processing services for integrated circuit manufacturing. They cater to varied needs, processing individual wafers for diverse production requirements.
Based in Redondo Beach, CA, Northrop Grumman provides private label chip manufacturing services. Its U.S. government-accredited Microelectronics Center is accessible to external aerospace and defense companies. They specialize in advanced diamond-cooled chips, delivering higher power and speed for military radar and communications systems, enhancing critical performance.
Based in Fayetteville, AR, Ozark Integrated Circuits specializes in designing and providing extreme solutions for demanding environments. The company develops rugged computing platforms tailored for critical applications, leveraging its expertise in integrated circuits to address complex challenges on Earth and in space.
Peko Precision Products is a vertically integrated, full-service contract manufacturer based in Rochester, NY. The company specializes in producing complex machinery, automation equipment, capital equipment, and precision assemblies for the semiconductor, medical, and defense industries. Capabilities include custom ATE systems, high-level assembly, and sheet metal fabrication.
Polar Semiconductor, LLC is an American semiconductor manufacturer based in Bloomington, MN, specializing in high-voltage semiconductors. The company serves demanding applications in markets such as automotive, AI data centers, aerospace & defense, and industrial sectors, with a focus on sustainable manufacturing practices.
Based in San Jose, CA, Presto Engineering offers comprehensive ASIC and microelectronics solutions, spanning design to mass manufacturing. They provide silicon platforms and semiconductor services, helping innovative companies industrialize integrated circuits up to full production for high technology markets.
Purewafer is a Silicon Valley foundry providing process development optimization solutions. The company specializes in delivering services for fabless semiconductor companies and original equipment manufacturers (OEMs).
Based in Escondido, CA, QP Technologies specializes in prototype and small-volume IC packaging and assembly services. They provide a full range of semiconductor capabilities, including wafer preparation, advanced packaging, substrate development, and laser services, helping clients bring designs to market quickly.
Based in Medford, OR, Rogue Valley Microdevices is a U.S.-based, ITAR-registered MEMS foundry. They provide MEMS design, process development, and production-grade fabrication from concept to volume production. Their services include in-house wafer services for 100mm-300mm wafer sizes.
SCD.USA Infrared LLC manufactures high-end infrared detectors and laser diodes. They supply infrared imaging solutions for defense, homeland security, and commercial sectors, including aerospace, semiconductor inspection, and process monitoring applications. Their semiconductor devices are deployed in demanding environments, requiring rigorous qualification.
Based in Chicago, IL, Sigenics, Inc. specializes in designing, testing, and delivering custom integrated circuits (ICs) and Application-Specific Integrated Circuits (ASICs). They offer turnkey ASIC production services for sensor, analog, and mixed-signal applications. Serving aerospace, defense, and medical industries, Sigenics produces reliable, cutting-edge silicon chips.
Based in San Jose, CA, Silitronics provides advanced semiconductor and photonics packaging. They offer turnkey solutions from design to volume production, including onshore wafer processing, thinning, polishing, dicing, and advanced build-up substrate fabrication. The company supports high-speed data, AI, HPC, and next-gen computing.
Based in Logan, UT, SnackCo of America is a large-scale private label and co-packing manufacturer of kettle and continuously fried potato chips, tortilla chips, popcorn, and pellet snacks. They produce over 20 million pounds annually from a BRCGS AA Certified facility.
StratEdge Corporation, based in Poway, CA, manufactures, assembles, and tests high-performance semiconductor packages. They specialize in molded and post-fired ceramic packages for GaN, GaAs, and SiC devices, including gold-plated tabs for high-power chip-on-board applications. StratEdge's U.S. operations serve RF, microwave, space, and defense industries.
Based in San Jose, CA, SunMan Engineering offers Original Design Manufacturing (ODM) and semiconductor technology services. They provide concept-to-manufacturing support, including design, development, and prototyping for complex electronic projects. Since 1990, they have assisted technology companies with product development, leveraging extensive engineering expertise.
Teledyne MEMS is a pure-play MEMS foundry, providing chip manufacturing services. The company operates over 41,000 sq ft of clean rooms 24/7, utilizing both 150mm and 200mm wafer processes. They offer direct private label production for micro-electro-mechanical systems.
Based in Salem, NC, Triad Semiconductor specializes in developing high-performance analog and mixed-signal custom ASICs. The company provides tailored chip solutions, also targeting Application Specific Standard Products (ASSPs) for various industries, including virtual reality and augmented reality applications.
Based in Brooklyn Park, MN, Trusted Semiconductor Solutions Inc. specializes in high-reliability semiconductor design and product development. They offer expertise in radiation-hardened microelectronics, providing custom solutions for clients requiring robust and specialized chip manufacturing capabilities.
TSMC (Taiwan Semiconductor Manufacturing Company Limited) is the world's dedicated semiconductor foundry, established in 1987. It specializes in manufacturing integrated circuits for clients, enabling them to market products under their private label. The company maintains significant US operations across Arizona, California, Massachusetts, Texas, and Washington.
X-FAB is a global foundry group specializing in analog/mixed-signal, microsystems/MEMS, and silicon carbide (SiC) semiconductor technologies. They serve as a manufacturing partner for customers, primarily in the automotive, industrial, and medical markets. X-FAB operates multiple wafer fabrication facilities, including some in the United States.
AIM Photonics offers end-to-end silicon photonic manufacturing for custom chip designs. As a U.S. DoD Manufacturing Innovation Institute, they provide comprehensive services from design and fabrication to packaging and validation. They facilitate prototyping via Multi-Project Wafers, offering a direct path to volume manufacturing for various clients.
Based in Carlsbad, CA, California Semiconductors Technology designs core technology for IoT, automotive, and telecommunication. They specialize in innovative solutions to locate and wirelessly connect devices and people, enabling advancements in smart homes, self-driving cars, and connected health applications.
Based in Malta, NY, GlobalFoundries operates as a semiconductor foundry with extensive manufacturing sites across the U.S. The company specializes in advanced semiconductor technologies, including silicon photonics, RF-SOI platforms, and GaN-on-silicon solutions. They provide high-performance, security-critical applications and next-generation packaging for various industries.
Based in Irvine, CA, Mixed-Signal Devices delivers multi-gigahertz digital timing solutions with ultra-low jitter, stability, and programmability. They utilize an all-digital, CMOS-based architecture with a patented synthesis engine, replacing legacy analog clocks. Their advanced timing chips power critical AI infrastructure, 5G networks, and high-performance automotive platforms.
Based in Rockford, IL, Ole Salty's specializes in private label and co-packing for small-batch, kettle-cooked potato chips. They partner with breweries, restaurants, and various brands, producing custom chip recipes. This enables businesses to offer unique, branded snack options, with Ole Salty's providing tailored manufacturing solutions.
Based in Houston, TX, Integrated Circuit Solutions is an UL Listed Original Equipment Manufacturer (OEM). The company brings over 50 years of combined experience in the electrical market, specializing in providing integrated circuit solutions.
SkyWater Technology is a U.S.-based, pure-play semiconductor manufacturer and DMEA-accredited trusted supplier. The company operates as a technology foundry, providing advanced innovation engineering services. It specializes in streamlining the concept-to-production journey for various chip designs.
We support a variety of IC assembly and hybrid technologies, including wire bonding, flip chip ball grid arrays (FCBGA), multi-chip modules, and various other.
Our Fabrication Services has a proven track record of delivering record device performances and working with customers in successfully taking their technologies.
Integrated Circuits, Licensed Intellectual Property, and Semiconductor Fabrication. We look forward to serving you.
Design & Manufacturing Services (ODMs) +886-2-8692-6796, 3002 Dow Ave #506, Tustin, CA 92780 ・ ・ 886-2-8227-3112 ・ 39889 Eureka Drive Newark,
Testing is the final step that validates the functionality and reliability of semiconductor devices before they are shipped to customers.
Tower Semiconductor supplies strategic, on-shore foundry services for critical U.S. Aerospace and Defense (A&D) applications through its industry and segment.
A custom ASIC design is the process of designing a tailor-made, unique, and fully customized integrated chip circuit, specifically for a particular application.
s Customer Service: … we deliver high-quality PCB assembly and electronic manufacturing solutions. Comprehensive, USA-Based Electronic Assembly.
Microelectromechanical systems (MEMS) is the technology of very small devices; 3350 Scott Blvd. Bldg. 4502 Santa Clara, CA 95054 P:. Addison.
American Semiconductor develops and manufactures state-of-the-art, ultra-thin electronics technology, including chip packaging.
Private Label & Co-Manufacturing. If you are looking for a partner to develop, design, and create your own unique snack, you have come to the right place!
We outsource the semiconductor manufacturing process to a network of global suppliers, which includes fabrication, assembly and test, and distribution. This.
Our fully integrated, on-site manufacturing facilities give us the flexibility to develop private label or co-manufacture custom chips. We have.
GPR Company is one of the nation's leading contract manufacturers serving the state-of-the-art semiconductor equipment industry.
Machine silicon carbide semiconductors with exceptional precision & efficiency while enhancing throughput with Hyperion's innovative solutions. Learn more!
Manufacturing division specializes in the ability of fabricating Printed Circuit Boards, Flexible Circuit Boards, and Custom Equipment Boxes.
Integense delivers custom ASIC solutions abilities that include definition, design, verification, sorting, testing, and high volume manufacturing. +1 888 854.
We currently produce private label for national grocery and drugstore accounts, as well as regional grocery chains. Style Potato Chips.
Customized silicon—chips uniquely tailored to meet the performance and power requirements of an individual customer for a particular use case—.
Mixed Signal Integration is an integrated circuit company specializing in the design, manufacture and sale of turn-key analog and mixed-signal standard products.
Electronic Contract Manufacturing (ECM) is the outsourcing of electronic product assembly, testing, and associated services to a specialized.
Sierra Circuits offers one-stop PCB assembly services in our Silicon Valley location.
Learn more about our private label and co-manufacturing capabilities. Our experienced R&D team can help you produce the perfect snack for your brand.
Based in Arden Hills, MN, Syagrus Systems provides precision semiconductor wafer fabrication services. The company specializes in producing various wafer and die shapes, forms, and configurations. They serve OEMs and other manufacturers seeking custom solutions for their semiconductor component needs.
Toshiba's extensive lineup of power management ICs ranges from low- to high-power devices. We offer the ideal power solutions with high quality and safety.
Explore the U.S. semiconductor boom, its drivers, challenges, and contributions from companies like Vergent Products to boost domestic IC.
Kyocera International's contract assembly offers design and engineering support, BOM procurement, and a wide selection of substrate and circuit board materials.
AAI is a leading provider of complete ASIC design (Front End, Back End and Verification) and turnkey manufacturing services for fabless companies and OEM's,
Bosch is expanding its SiC manufacturing capabilities both in Reutlingen and at its new wafer fab in Roseville, California.
Assembly & Test – the critical post-production stage that determines semiconductor chip performance, reliability, and market readiness.
Healthcare semiconductor solutions delivering custom medical ASICs for diagnostics, implantables, wearables, and connected medical devices with reliability.
With strategically located fabs in the United States and Taiwan, we offer a broad portfolio of manufacturing technologies, including high-voltage CMOS, BCDMOS,
GaN technology improves power conversion for consumer electronics by offering higher efficiency, smaller size, lighter weight, and faster charging capabilities.
Custom Silicon Solutions (CSS) is a leading developer and supplier of analog, mixed-signal, RF, and high-voltage turnkey ASICs. Phone Address.
Full-stack ASIC and FPGA design services from a US-based, Trusted IC vendor. Custom silicon for aerospace, defense, cyber, and commercial markets.
With R&D and manufacturing facilities in the U.S. Europe, and Asia, we focus on innovation throughout our business. As a trusted partner, we serve 100% of the.
Integra Technologies offers rapid, high-quality IC packaging and assembly services, services for custom, high-performance and high-reliability microelectronics.
Powered by the promises of the CHIPS Act, Intel is investing more than $100 billion to increase domestic chip manufacturing capacity and capabilities.
MOSIS 2.0 is the central storefront and gateway to access cutting-edge prototyping services, targeting advanced RF, 5G/6G, and EW applications.
Science Foundry is a commercial foundry with comprehensive MEMS fabrication capabilities. Accelerate your project from first wafer to volume production.
SEMIFIVE provides the customer suited turnkey services including wafer fabrication, packaging, and testing with efficiently operated supply chain management.
Sequans designs low-power Cellular IoT chips. With over 20 years of proven expertise in cellular IoT, technology for North America.
SimpleChips has extensive experience in ASIC design and manufacturing services for medical, industrial and defense applications.
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| Type | Best For | Typical MOQ |
|---|---|---|
| Pure-Play Foundry | Buyers with extensive in-house IC design and verification teams, seeking direct silicon fabrication. | High volume (10,000+ wafers/year for advanced nodes) |
| Fabless Design House | Companies needing a full turnkey solution from concept to silicon, without in-house IC design expertise. | Medium to High volume (5,000+ units, depending on design complexity) |
| OSAT (Outsourced Assembly & Test) | Customers with fabricated wafers needing advanced packaging, assembly, and rigorous final electrical testing. | Variable, from thousands to millions of units |
| Vertically Integrated IDM (Private Label) | Large enterprises requiring specific process technology or established reliability, leveraging an IDM's excess capacity. | High volume (50,000+ units) |
A pure-play foundry specializes solely in wafer fabrication; they take your GDSII files and produce silicon. You are responsible for all design, verification, and often packaging/test. A fabless design house, conversely, offers an end-to-end solution. They handle the entire chip design process, manage the relationship with the foundry, and often oversee packaging and testing. For a private label project, a fabless design house reduces your internal engineering burden, while a pure-play foundry offers more direct control if you have extensive in-house design expertise.
Robust IP protection is paramount. Always start with a comprehensive Non-Disclosure Agreement (NDA) and ensure your manufacturing agreement clearly defines IP ownership, usage rights, and confidentiality obligations. Request their security protocols for handling your GDSII layout files, RTL code, and test vectors, including secure data transfer methods and access controls. Consider IP escrow services, especially for sensitive designs, and perform due diligence on their track record and commitment to IP security, looking for certifications like NIST 800-171 if applicable.
Test vectors are critical for verifying the functionality and performance of your private label chip during wafer sort and final package test. They are sequences of inputs and expected outputs that detect manufacturing defects and confirm logic correctness. Inadequate or incomplete test vectors can lead to shipping faulty chips, expensive field failures, and costly re-spins. You must provide comprehensive, high-coverage test vectors that exercise all critical paths and functions, often developed through robust Design for Testability (DFT) methodologies integrated into your design flow.
A multi-source strategy, using two or more foundries or OSATs for the same chip, should be considered for high-volume products, critical components, or when mitigating supply chain risks (e.g., geopolitical, natural disaster). This enhances supply resilience and can provide leverage for cost negotiation. The primary challenges include higher Non-Recurring Engineering (NRE) costs due to re-qualification, potential process variations between different fabs (even for the same process node), ensuring IP consistency across multiple vendors, and managing the increased complexity of logistics and quality control.