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Last updated: January 2026
This directory lists 56 wire bonding companies across the United States, from high-volume automated operations supporting consumer electronics to specialized R&D and prototyping services catering to emerging medical and aerospace applications.
Buyers are typically solving critical interconnect challenges, ranging from achieving consistent bond pull strength on sensitive die pads to mitigating the risk of wire sweep during subsequent molding. Many projects require precision loop control for optimal clearance within tight package geometries, or robust interconnections that can withstand severe thermal cycling without exhibiting intermetallic growth or bond pad lifting. The ultimate goal is often high yield and long-term reliability under challenging environmental conditions.
The wire bonding supplier landscape includes several types. Large Electronics Manufacturing Services (EMS) providers often incorporate wire bonding as part of a broader assembly offering, suitable for high-volume, standardized projects. Conversely, dedicated contract bond houses specialize solely in wire bonding, frequently possessing advanced equipment for fine pitch, deep access, or specific materials like ribbon bonding. There are also smaller, niche players, often serving prototyping, NPI (New Product Introduction), or highly specialized military/medical applications where engineering support and flexibility outweigh sheer volume capacity.
To engage effectively, buyers should prepare detailed bond diagrams, package substrate material specifications, and clear reliability requirements, including expected environmental conditions and any necessary test methods (e.g., wire pull, ball shear, HAST). Suppliers, in turn, expect a well-defined scope of work, material safety data sheets for any provided components, and an T an understanding of the desired Cpk (Process Capability Index) targets for critical bond parameters. This upfront clarity significantly accelerates quoting and project execution.
56 companies nationwide
Sanmina’s Advanced Microsystems Technologies Division provides comprehensive microelectronic packaging and optical assembly services. They specialize in advanced packaging for custom die, modules, heterogeneous integration, and next-generation chiplet technology. This team offers complete lifecycle support for advanced products, from design to efficient production.
Advotech Company Inc., based in Tempe, AZ, offers a wide range of semiconductor packaging, testing, and PCB services. Established in 1992, they provide wire bonding to various substrates, including ceramic, PCBs, and flex circuits. They also specialize in rapid prototyping, engineering services, and production planning.
Amkor Technology is a US-based provider of advanced semiconductor packaging and test services. Offering comprehensive OSAT solutions for global chip manufacturers, the company performs critical assembly processes, including wire bonding, using its state-of-the-art facilities and extensive engineering expertise to support diverse applications.
AmTECH Microelectronics Inc., based in Morgan Hill, CA, is a custom microelectronics assembly and packaging services provider. With over 30 years of experience, they specialize in fine and heavy wire bonding, flip chip, die bonding, and SMT assembly. Certified to ISO 9001:2015 and ISO 13485:2016, AmTECH serves defense, aerospace, and medical sectors.
Analog Technologies provides contract manufacturing services for electronic printed circuit board assemblies, specializing in high reliability, complex, and challenging applications. They offer low volume/high mix production, including advanced packaging and wire bonding capabilities. Markets served include Aerospace, Military/Defense, High Reliability Commercial, Industrial Instrumentation and Test, and Medical Electronics.
Based in Lakeville, MN, Automated Assembly Corporation specializes in Roll to Roll SMT-Flexible Assembly. The company provides prototype flexible circuit services, utilizing advanced bonding techniques like wire bonding for inter-connects to various substrates. They focus on Design for Manufacturability for high-yield production.
Azimuth Industrial Co., Inc., based in Union City, CA, specializes in automated copper/gold and aluminum wire bonding for semiconductor packaging. They also provide die attach and flip chip bonding services, supporting projects from rapid prototyping to medium-volume assembly.
Based in Hillsboro, OR, Cascade Systems Technology is an electronic contract manufacturer specializing in microelectronics assembly. The company provides manual and automated gold ball bonding and manual aluminum wedge bonding on PCBs and flex. They serve aerospace, medical, and semiconductor industries, holding ISO 9001:2015 certification.
STC Material Solutions manufactures highly engineered advanced materials, specializing in electrical feedthroughs, opto-electronic windows, and ceramic-to-metal seals, bonds, and packages. They provide solutions in technical ceramics, hermetic sealing, and joining dissimilar materials for various mission-critical applications.
Based in Lincolnshire, IL, Cole Wire & Cable Co., Inc. specializes in custom wire and cable solutions, including bonding conductors for custom bonded cables. They serve OEMs, contractors, and distributors with high-quality products, fast turnarounds, and value-added services like cut-to-length prep for various industrial applications.
Based in Huntsville, AL, Engenius Micro specializes in advanced manufacturing, providing innovative printed wire bonds. These self-supporting printed wire bonds enhance design flexibility in various printed package devices. The company supports applied electronics, MEMs, and microsystems industries with its specialized manufacturing services.
Based in Newburyport, MA, Electronic Products Inc. (EPI) is a vertically integrated manufacturer of high-quality custom microelectronic hermetic packages. They provide advanced ceramic and glass-to-metal sealing solutions for durability and reliability. EPI serves critical applications across medical, imaging, military, aerospace, satellite, sensor, and industrial sectors.
Based in West Palm Beach, FL, Forte Micro designs and manufactures electronic and electromechanical components and turnkey systems. The company provides advanced solutions for industries such as aerospace & defense and automotive, focusing on complex component development and integrated system manufacturing.
Golden Altos provides wire bonding services utilizing high-speed, fine-pitch bonders and offers a standard variety of wire types and diameters. The company specializes in assembly package configurations and also provides qualification and program management services for its clients.
Based in Solon, OH, Hana Technologies, Inc. provides global microelectronics manufacturing services and RFID products. The company offers lean contract manufacturing, assembly services, and IC packaging solutions. Its capabilities include PCBA, SMT, camera modules, and box build, serving various IoT and microelectronics applications.
Hughes Circuits, based in San Marcos, CA, is a fully integrated EMS company providing high-accuracy die attach and wire bonding services. They offer complete PCB layout, fabrication, and assembly, alongside precision metal fabrication. Specializing in time-critical and high-reliability products, they serve military, medical, and high-speed/RF industries.
Based in Clarksburg, NJ, Hybrid-Tek, LLC specializes in wire bonding and thick film hybrid circuit manufacturing. The company offers expertise in developing new products for industrial customers and is AS9100 and ITAR registered, ensuring compliant, high-quality solutions for complex hybrid programs.
Based in Sunnyvale, CA, Hybrid Circuits specializes in manufacturing and assembly of hybrid circuits. The company directly provides wire bonding services, offering technical support from specifications through testing and shipping. They deliver high-performance electronic components and integrated systems.
Intech Technologies International, based in Stone Mountain, GA, specializes in advanced semiconductor assembly and packaging solutions. They provide a comprehensive range of wire bonding services, including gold, aluminum, copper, and ribbon bonding. Additional offerings encompass die attach, encapsulation, flip chip, and custom automation services.
Based in Rosenberg, TX, Martin Company is an ISO 9001 certified electronics engineering, design, and manufacturing firm. They offer comprehensive prototype and production services, including PCB layout, assembly, and testing for custom electronic systems. Their expertise serves demanding industries such as Oil & Gas and Subsea.
Micross provides automated and state-of-the-art manufacturing services, including die attach, wire bond, encapsulation, and CSP capabilities. They offer competitive solutions for a broad range of applications, leveraging advanced technology to meet diverse industry needs.
Based in San Diego, CA, NPI Services Inc. is a microelectronics contract manufacturing company. It specializes in advanced assembly solutions, including comprehensive wire bonding, die bonding, and flip chip assembly. The company also provides wafer dicing, encapsulation, and optical assembly services for high-reliability applications.
Based in Carlsbad, CA, Palomar Technologies provides automated component packaging and contract assembly services. The company specializes in high-accuracy microelectronic packaging, offering expertise in wire bonding, die attach, and flip chip solutions. They leverage precision equipment to deliver custom assembly for various industries.
Based in Houston, Texas, PPSI is an electronics manufacturer specializing in comprehensive PCB assembly services. Their capabilities include SMT, thru-hole technology, RoHS compliance, BGA expertise, and handling of fine-pitch 0201 components. PPSI provides advanced electronic manufacturing solutions for various industries.
Based in Santa Clara, CA, Promex Industries is a contract manufacturer specializing in advanced microelectronics assembly and precision packaging. They offer integrated manufacturing workflows from wafer processing and die prep to SMT, supporting complex microelectronic devices and heterogeneous integration for various substrates.
Rush PCB is a US-based PCB manufacturer specializing in quick-turn prototyping, fabrication, and assembly services. The company provides comprehensive turnkey PCB solutions for a wide range of industries, offering advanced assembly capabilities critical for complex electronic designs.
S&C Micro offers precision wire bonding services and advanced packaging solutions, including quick-turn prototypes. Based in Livermore, CA, they specialize in gold bonding wire, die attach, flip chip, and other micro system integration techniques. This ITAR registered, US-based company supports innovation in new technology.
Silitronics is a partner for advanced semiconductor and photonics packaging, specializing in design, fabrication, and assembly. They offer automatic wire bonding at 20μm pitch and precision optical alignment. The company provides next-gen semiconductor packaging, build-up substrate fabrication, and onshore wafer processing services.
Based in Elyria, OH, SMART Microsystems provides microelectronic sub-assembly manufacturing services as a key part of the semiconductor supply chain. The company offers core wire bonding capabilities and expertise for microelectronics and MEMS sensor products, complemented by in-house test and inspection facilities.
Based in Elyria, OH, SMART Microsystems Ltd. specializes in microelectronic sub-assembly manufacturing services for the semiconductor supply chain. The company offers process development expertise and in-house test and inspection capabilities to support the development and production of next-generation microelectronic sub-assemblies.
SPECTRUM Advanced Manufacturing Technologies, Inc. provides quick-turn electronic manufacturing services, specializing in prototype wire bonding, encapsulation, and microcircuit advanced packaging. Serving aerospace, medical, industrial, and commercial sectors since 1997, the Colorado Springs, CO-based company delivers high-reliability solutions and product development.
Based in Madison, AL, STI Electronics, Inc. operates a microelectronics lab specializing in advanced packaging design and microelectronics assembly services. The company also provides comprehensive training and certification programs to industry standards, including IPC and NASA-STD, for electronic assemblies.
Based in Santee, CA, StratEdge specializes in high-performance ceramic packages for GaN, GaAs & SiC devices. Their ISO 9001:2015 certified facility includes a Class 1000 clean area, offering assembly and test services. They support defense, satellite, test & measurement, automotive, and downhole industries.
TT Electronics provides end-to-end complex electronics manufacturing solutions, including fully automated die bonding and wire bonding services. The company specializes in delivering manufacturing capabilities for medical power, connectivity, and sensor solutions across various industries.
Based in Williamsburg, VA, USsemi Inc. specializes in a range of advanced semiconductor packaging services. Their offerings include 2D wafer-level packaging and 2.5D interposer/Si solutions, crucial for integrating complex electronic components. The company provides essential capabilities for modern semiconductor assembly.
Based in Tempe, AZ, Verigon is a contract electronic manufacturer specializing in mission-critical PCBA, electronic, and electromechanical assemblies. The company provides hybrid microelectronic manufacturing capabilities, including interconnect technology, for demanding industries such as defense, medical, and aerospace.
Based in Austin, TX, VIRTEX is an Electronic Contract Manufacturer (EMS) specializing in strategic manufacturing solutions. Services include printed circuit assembly, cable & harness, and system integration for military & aerospace, medical, and industrial sectors, with a focus on quality and compliance.
Based in Shawnee, KS, Xsis specializes in hybrid microcircuit technologies and quartz crystal manufacturing. With over 46 years of experience, this certified supplier provides specialized electronic assembly services for complex components, likely including precision wire bonding for microcircuit integration.
AIM Photonics operates a state-of-the-art 300 mm facility specializing in integrated silicon photonics test, assembly, and packaging. Their services include advanced microelectronic fabrication and interconnection techniques, highly likely encompassing wire bonding for robust component integration. This facility supports the development and deployment of next-generation photonics technologies.
Based in Miramar, FL, Die Level Services LLC provides comprehensive microelectronics engineering and manufacturing services. They specialize in wafer design, manufacturing, and package design, including flip chip, WLP, and wire bonding technologies. The company offers turnkey solutions for packaging, assembly, and testing.
Based in San Jose, CA, STNF is a sensor foundry providing wire bonding services for electrical interconnections between semiconductors and silicon chips. They offer Gold (Au) and Aluminium (Al) wires as part of their ROIC/CMOS process capabilities.
Based in Alpharetta, GA, Weller PCB provides precision die bonding and wire bonding services for robust interconnection between semiconductor chips and PCB substrates. With over 20 years of experience, the company specializes in high mix & low volume electronics manufacturing services and serves larger OEMs, offering comprehensive PCB assembly solutions.
American Dicing, Inc., in Liverpool, NY, offers direct wire bonding (ball, wedge, heavy ribbon) using gold or aluminum. They provide precision wafer dicing and die sorting for microelectronic packaging. Serving military, aerospace, medical, and commercial electronics, they handle prototypes to production volumes.
Micro Precision Technologies (MPT), based in Salem, NH, specializes in high-temperature electronics and power semiconductor packaging. The company provides both manual and automated wire bonding, including ball and wedge bonding, alongside die attachment, auto dispense, and hybrid assembly services. MPT offers comprehensive solutions for prototype die packaging and production.
Microsembly specializes in precision wire bonding services, utilizing ball, wedge, and ribbon bonding techniques for high-performance microelectronics. The company offers advanced RF microwave assembly solutions, serving the aerospace, defense, space, medical, and commercial industries. They focus on continuous innovation and quality.
Neotech, in Carlsbad, CA, provides electronics manufacturing solutions for advanced technology OEMs. Serving high-tech industrial, aerospace & defense, and medical equipment, their 45,000 sq. ft. electronics manufacturing facility, a Ceramics Center of Excellence, offers specialized capabilities for complex assemblies and precision interconnection, including wire bonding.
Based in Eatontown, NJ, PCB Technologies provides advanced IC packaging services through its iNPACK division, including wire bonding. They specialize in fine wire welding to secure chips to boards, offering PCB assembly and solutions. The company serves aerospace, defense, automotive, medical, and semiconductor industries.
Based in Escondido, CA, QP Technologies provides prototype and small-volume IC packaging and assembly services. They perform wire bonding utilizing automatic equipment, offering full turn-key solutions. The company is ISO 9001, ISO 13485, and AS9100D certified, ensuring high-reliability for critical applications.
Texas Management Associates, Inc., based in Pasadena, TX, offers comprehensive electronic manufacturing services. They specialize in high-reliability applications, providing printed circuit board assembly, system integration, testing, and dedicated wire bonding services. The company supports clients in aerospace, defense, oil & gas, and medical sectors with their electronic manufacturing requirements.
Teledyne Micropac provides innovative optoelectronic components, electronic assemblies, and multi-chip microelectronic modules. They leverage an advanced technology portfolio for demanding aerospace and defense applications, including critical microelectronic fabrication. This encompasses precision wire bonding for robust interconnects within their complex modules.
Teledyne Defense Electronics provides advanced services for optoelectronic modules, specializing in design, modeling, alignment, packaging, qualification, and testing. They leverage an advanced technology portfolio tailored for demanding aerospace and defense applications.
S&C Micro Inc is a California-based company that provides quick-turnaround wire bonding and part attachment services. They specialize in rapidly processing up to five parts, often completing work within 1-3 days for standard wire bond requirements.
AMETEK Aegis designs and manufactures hermetic glass-to-metal seal microelectronic packages and custom electronic packaging in glass and ceramic. They provide HTCC Feedthroughs, Flatpacks, and Machined Housings. Their products serve high-reliability, mission-critical applications, particularly in the defense sector, for specialized microelectronic packaging needs.
APIC offers advanced wirebonding services, including Ball, Wedge, and Ribbon types. They provide wirebonding for devices on submounts, specializing in heterogeneous integration of photonics and electronics. APIC supports CMOS, compound semiconductor, and silicon-photonic chip-scale integration.
Based in Waltham, MA, Excelitas Technologies Corp. specializes in advanced electronic and optronic solutions. The company offers specialized micro-assembly and packaging services, including comprehensive die bonding, wire bonding, and flip-chip assembly. They provide custom manufacturing of high-performance photonic solutions for diverse industries.
Integra Technologies specializes in turnkey IC packaging services for custom, high-performance, and high-reliability microelectronics. The company performs advanced packaging, assembly, and test operations, including wire bonding, to meet stringent industry demands.
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Gold wire offers excellent corrosion resistance and robust bonds, but at a higher material cost. Copper wire is a cost-effective alternative with good electrical conductivity, but requires tighter process control to prevent oxidation and can be harder on bond pads. Aluminum wire is typically used for larger diameter wires on specific semiconductor packages and power applications, offering good thermal conductivity and resistance to intermetallic growth with aluminum bond pads. The choice hinges on cost, reliability requirements, package substrate metallization, and overall process complexity.
Consistent loop control starts with precision equipment and optimized bonding parameters, including accurate wire tension and ultrasonic settings. Preventing wire sweep, especially in molded packages, requires careful DFM (Design for Manufacturability) input from your bonding partner, considering wire length-to-diameter ratios, mold compound viscosity, and fill speeds. Specifying maximum allowable wire sweep during the design phase helps define the process window and often necessitates advanced bonders with active loop control.
The bond pad metallization is critical for forming reliable intermetallic bonds. Gold wire typically bonds well to gold, nickel, or aluminum pads. Copper wire often requires a barrier layer like nickel-palladium-gold (ENEPIG) to prevent excessive intermetallic growth and improve reliability. Aluminum wire is typically bonded to aluminum bond pads. Mismatched metallizations can lead to poor adhesion, voids, or accelerated intermetallic formation, which degrades reliability over time, particularly under thermal cycling.
Deep access wire bonding refers to the ability of a bonder's capillary (the tool that dispenses and forms the bond) to reach bond pads situated deep within a package, often surrounded by tall walls, other components, or within stacked die configurations. It's critical for System-in-Package (SiP), Chip-on-Board (CoB), or multi-chip module (MCM) designs where space is highly constrained. Without deep access capability, certain bond pads may be unreachable, or the resulting wire loops could be compromised by interference with adjacent structures.