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Last updated: January 2026
This directory lists 56 flip chip assembly companies across the United States, from specialized NPI (New Product Introduction) development houses focused on rapid prototyping to large-scale, high-volume manufacturers catering to automotive and data center applications.
Buyers engage these suppliers to solve critical challenges such as achieving ultra-fine pitch interconnects for high-density ICs, mitigating device warpage during reflow, and ensuring robust underfill coverage to protect vulnerable C4 or copper pillar bumps. They are essential for integrating complex silicon dies into advanced packages where traditional wire bonding is no longer feasible due to performance, form factor, or electrical characteristics.
The types of suppliers in this space range from dedicated OSATs (Outsourced Semiconductor Assembly and Test) that offer comprehensive back-end services, to specialized design-and-assembly houses focusing on specific market niches like RF or photonics, and even certain vertically integrated IDMs (Integrated Device Manufacturers) that offer external assembly services for unique projects. What distinguishes them often comes down to their equipment set (e.g., capabilities for thermocompression bonding vs. mass reflow), their quality system maturity, and their experience with specific substrate materials and bumping technologies.
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56 companies nationwide
Advanced Microsystems Technologies, a Sanmina division, provides complete lifecycle services for advanced microelectronics packaging. This includes custom die, modules, heterogeneous integration, and next-generation chiplet technology. They also offer advanced design and assembly for optical and RF components, serving industries such as automotive.
Based in Tempe, AZ, Advotech Company Inc. specializes in a wide range of semiconductor packaging, testing, and PCB services. Established in 1992, they offer rapid prototyping, engineering, and production planning. Capabilities include wire bonding to various substrates like ceramic, PCBs, and flex circuits.
Amkor Technology, based in Tempe, AZ, is a US provider of outsourced semiconductor assembly and test (OSAT) services. They specialize in advanced packaging solutions, including flip-chip assembly, for global chip manufacturers. Amkor supports diverse industries with comprehensive back-end manufacturing capabilities.
Based in Tempe, AZ, Amkor Technology, Inc. provides contract semiconductor assembly and test services. The company offers advanced packaging and test solutions for various semiconductor devices, serving a global client base with its comprehensive manufacturing capabilities.
AmTECH Microelectronics Inc. provides custom microelectronics assembly and packaging services from its Silicon Valley facility. With over 30 years of experience, they specialize in flip chip bonding, die bonding, and wire bonding for prototype to production volumes, serving defense, medical, and telecom markets.
Based in Santa Barbara, CA, Atomica Corp. provides rapid prototyping and scalable production for MEMS devices. Specializing in advanced microfabrication, they integrate complex layers and diverse materials. Capabilities include design, lithography, deposition, etching, wafer bonding, and backend wafer processing, crucial for high-performance solutions in thermal imaging and sensing applications.
Automated Assembly Corporation, based in Lakeville, MN, specializes in advanced electronic assembly. They perform flip chip die bonding using solder or wire bonding. The company manufactures circuitry onto one thousand-foot rolls and provides interconnect solutions to various substrates for diverse applications.
Based in Union City, CA, Azimuth Industrial Co. Inc. provides ISO9001:2015 and ITAR-registered semiconductor packaging and assembly services. Specializing in plastic and ceramic packaging, they offer fast-turn prototyping, pilot build, and small-to-medium volume assembly. Capabilities include fully automated high accuracy die attach and flip chip bonding.
Based in Santa Clara, CA, BroadPak specializes in 2.5D/3D integration technologies and comprehensive package design. The company offers development services and innovative total solutions for advanced semiconductor packaging, crucial for modern electronic devices. Their expertise supports complex microelectronics assembly requirements.
Based in Santa Ana, CA, PARPRO Technologies, an ISO/AS9100C certified EMS provider, offers turnkey PCBA, SMT assembly, and full system integration. Specializing in advanced placement for 01005 components, Micro BGAs, and PoP technologies, they serve aerospace and military industries with high-quality manufacturing solutions.
Based in Hillsboro, OR, Cascade Systems Technology is an electronic contract manufacturing company. It provides PCBA, systems integration, testing, and microelectronics assembly services. The company serves diverse sectors, including AI/data centers, military/aerospace, medical devices, semiconductor manufacturing, and clean energy. They are ISO 9001:2015 and ITAR registered.
Based in Norcross, GA, Engent, Inc. provides next generation electronic manufacturing and technology services. The company specializes in flip chip and bonding services, leveraging world-class facilities and an experienced team. Engent assists clients in shortening time to market and achieving high-volume production for advanced electronic systems.
Based in El Segundo, CA, EPC, Inc. provides comprehensive electronic packaging and semiconductor assembly services. Their capabilities include flip chip assembly, wafer backgrinding, dicing, die attach, and wire bonding. Serving the aerospace, medical, automotive, and industrial sectors, EPC offers advanced manufacturing solutions for various component needs.
Based in Irwindale, CA, FinePitch Electronic Assembly specializes in advanced fine pitch electronic assembly services. They provide crucial manufacturing capabilities for intricate electronic components, catering to industries requiring high-density packaging and precise interconnection solutions, including flip chip processes.
Based in Fremont, CA, Golden Altos provides microelectronic assembly services. The company utilizes advanced Die Attach equipment to optimize die planarity and maintain consistent Bond Line Thickness (BLT) on units, ensuring quality. They offer comprehensive assembly, qualification, and program management for B2B clients.
Based in San Marcos, CA, Hughes Circuits Inc. is an integrated electronics manufacturing service company. They provide advanced microelectronics assembly and packaging services, alongside comprehensive PCB layout, fabrication, and full-service assembly. Specializing in quick-turn and high-reliability products for military, medical, and high-speed/RF markets.
Based in Cherry Hill, NJ, International Micro Industries provides wafer bumping, an essential service for flip chip assembly. The company also offers comprehensive wafer-level packaging (WLP) for the microelectronics industry, operating from its US facilities with decades of experience.
Meritronics provides comprehensive semiconductor product solutions, including IC design, wafer fabrication, and advanced packaging. Based in Concord, CA, the company specializes in flip-chip, wafer-level, and system-in-package solutions for high-performance and miniaturized electronic devices. Meritronics offers full supply chain management across computing and industrial sectors.
Based in Centennial, CO, Micross is a DMEA DoD Trusted Source OSAT provider specializing in advanced packaging solutions for US electronics manufacturers. They offer expertise in flip chip assembly, wirebond, and multi-chip module (MCM) assembly, helping clients reduce risks, delays, and costs in their semiconductor projects.
Northrop Grumman is a defense technology company that specializes in hardening microelectronics and protecting spacecraft semiconductors for the harshest environments. They utilize advanced test fleets to accelerate innovation from concept to combat, providing robust electronic systems for critical aerospace and defense applications.
Palomar Technologies provides advanced microelectronic contract assembly services, including high-accuracy flip chip assembly, wire bonding, and die attach. They offer comprehensive solutions for optoelectronics, RF modules, and MEMS, supporting customers who require high-precision packaging without investing in their own equipment.
Pelican Packaging provides automated backend semiconductor processing, including electrical testing, Automated Optical Inspection (AOI), and sorting. They specialize in volume wafer processing, offering laser marking, dicing, and comprehensive WLCSP packaging. The company also performs high-speed tape and reel services with integrated vision and electrical inspection.
Priority Package, based in Richardson, TX, specializes in repackaging services for microelectronic components. The company handles flip chips, bare die, and other sensitive chips, providing essential processing for customers in the semiconductor and electronics industries, supporting the supply chain for advanced chip integration.
Based in Santa Clara, CA, Promex Industries is a contract manufacturer with over 50 years of experience in precision packaging and advanced microelectronics assembly. They provide integrated manufacturing services, including wafer processing, die prep, and SMT, for complex devices. Promex holds ISO certifications and operates Class 100 & 1000 Cleanrooms.
Qorvo specializes in developing and applying advanced flip-chip technology, including copper-pillar-on-GaN processes. They provide direct semiconductor assembly services, leveraging significant manufacturing capabilities to create high-performance, compact electronic components. Qorvo supports industrial and commercial applications through their innovative flip-chip solutions and expertise.
Based in Livermore, CA, S&C Micro provides expert microelectronics assembly services, specializing in flip chip attach, die bonding, and wire bonding. The company offers quick-turn prototype solutions for new technology integration, alongside eutectic attach, thermo compression bonding, and underfill processes. S&C Micro is ITAR Registered and serves the San Francisco Bay Area.
Based in San Mateo, CA, San Francisco Circuits provides high-density and fine-pitch PCB assembly services. The company focuses on advanced circuit board manufacturing and assembly solutions, catering to diverse industry needs for complex electronic designs.
Based in San Jose, CA, Silitronics offers advanced semiconductor and photonics packaging, including design, fabrication, and assembly services. They specialize in advanced flip-chip substrate fabrication, multi-chiplet SiP solutions, and precision optical alignment. The company also provides onshore wafer processing, supporting next-gen AI, HPC, and 6G networks.
Based in Elyria, OH, SMART Microsystems Ltd. specializes in microelectronic sub-assembly manufacturing services for the semiconductor supply chain. The company offers process development, in-house test and inspection, and die attach capabilities, supporting the development and production of next-generation microelectronic sub-assemblies for various products.
STI Electronics, Inc. operates a microelectronics lab specializing in state-of-the-art packaging design and microelectronics assembly services. Based in Madison, AL, with facilities in Houston, TX, the company provides direct manufacturing. STI also offers comprehensive IPC and NASA-STD training programs.
SunMan Engineering, based in San Jose, CA, provides end-to-end semiconductor services. Their offerings include custom designs, fabrication support, and advanced packaging, along with comprehensive testing. Since 1990, the company has assisted technology firms with numerous product development projects.
Texas Microelectronics Corporation specializes in advanced microelectronics assembly and packaging services. They offer expertise in DSP/ASIC Hybrid modules, Slim Package Multi-Chip Modules (MCMs), and DC-DC Converters. The company provides critical assembly services for complex electronic components, delivering high-reliability microelectronic solutions.
Based in Austin, TX, TLMI Corporation specializes in advanced wafer bumping services essential for flip chip assembly. They provide comprehensive solder, gold, copper, and indium bumping solutions. TLMI assists clients with device transfer to high-volume wafer bumping processes, supporting the semiconductor and microelectronics industries.
Based in Williamsburg, VA, USsemi Inc. specializes in precision flip-chip assembly services. The company ensures high-quality connections and enhanced performance for electronic components, supporting advanced manufacturing needs. Their expertise provides reliable integration solutions for various industries requiring precise component interconnection.
X-FAB is a global semiconductor foundry group, providing specialty technologies and design IP with US-based wafer fabs. They offer manufacturing services, including wafer-level packaging and 3D integration for analog/mixed-signal, MEMS, and SiC products. X-FAB primarily serves the automotive, industrial, and medical markets.
AIM Photonics operates the nation's first accessible 300 mm state-of-the-art facility for integrated silicon photonics test, assembly, and packaging. This foundry offers advanced services for photonic integrated circuits, directly providing specialized capabilities for manufacturing, including flip chip assembly processes for next-generation optoelectronics.
Based in Halethorpe, MD, Heisler Semiconductor LLC provides advanced semiconductor packaging, rapid prototyping, and turnkey production services. They offer flexible OSAT services, laser micro-machining, and 3D integration technologies for R&D through mid-volume. Key capabilities include Flip Chip Die Bonding, alongside wafer, chip, and PCB assembly.
Based in Costa Mesa, CA, Optelligent, LLC specializes in photonic packaging solutions and advanced microelectronics assembly. They offer quick turn assembly, automated wire bonding, and optical alignments. Expertise includes butterfly packages, TO cans, chip-on-pcb assemblies, and silicon photonics.
Based in Santa Barbara, CA, PseudolithIC designs and manufactures RFIC chips for RF and mm-wave telecommunication applications. Utilizing proprietary heterogeneous integration, they combine diverse semiconductor materials and functionalities into single chips. Their scalable process integrates compound semiconductor chiplets with silicon wafers, delivering high performance and power efficiency.
Based in Aurora, CO, AdvancedPCB is an American manufacturer offering comprehensive PCB design, manufacturing, and assembly services. They specialize in cutting-edge printed circuit boards, including HDI and rigid-flex, for demanding sectors like Defense & Aerospace, Medical Technology, and Telecommunications, providing high-reliability and quick-turn solutions.
Based in Orange County, CA, All Tech Electronics provides extensive flip chip assembly capabilities. Services range from single chip placements to complex multi-chip module and system-in-package assembly for various die types.
Based in Boise, ID, American Semiconductor, Inc. develops and manufactures state-of-the-art, ultra-thin electronics technology. The company specializes in advanced chip packaging and assembly services, including comprehensive design, prototyping, and testing solutions. They provide integrated support for high-performance flexible integrated circuits.
Based in Salem, NH, MPT provides semiconductor packaging services, including manual and automated wire-bonding and die-attach. They specialize in high-temperature electronics and power semiconductor packaging, offering solutions for prototype die packaging, hybrid assembly, and FR4 conversions.
Microsembly provides expert eutectic and epoxy die attach services, ensuring void-free, high-performance bonds with precision process control. They offer advanced RF microwave assembly solutions, delivering end-to-end services for critical applications. The company serves the aerospace, defense, space, medical, and commercial/industrial sectors.
NEOTech provides comprehensive electronics manufacturing solutions for advanced technology OEMs. The company combines over 40 years of heritage from NATEL, EPIC, and OnCore, serving high-tech industrial, aerospace & defense, and medical equipment sectors.
Based in Phoenix, AZ, Titan Circuits offers high-mix, low to medium volume electronic manufacturing services, specializing in PCB assembly from prototype to production. They handle components down to 01005 passives, QFNs, BGAs, and µBGAs. Their highly experienced staff holds IPC-A-610G and IPC J-STD-001G (with Space Addendum) certifications.
Based in Rockford, MI, Polymer Assembly Technology (PAT) specializes in precision proto-type and low-volume flip chip assembly. They serve markets like fine-pitch pixel imaging and temperature-sensitive II-VI/III-V devices, including optical, radiation, and biomedical sensors. PAT employs a proprietary low-cost, low-temperature curing conductive epoxy stencil printing technique.
ProtoExpress, powered by Sierra Circuits, provides American-made PCB prototypes and advanced assemblies. They offer high-quality, precise manufacturing with rapid turnarounds since 1986. Their expertise in advanced assembly, including BGA, is crucial for improving electrical and thermal performance, directly supporting complex requirements like flip chip applications.
Based in Escondido, CA, QP Technologies provides prototype and small-volume IC packaging and assembly services. They offer full turn-key solutions, including wafer preparation, backgrinding, dicing, die sort, and inspection. The company specializes in high-reliability assembly and holds ISO 9001, ISO 13485, and AS9100D certifications.
Teledyne Micropac Industries provides innovative optoelectronic components, electronic assemblies, and multi-chip microelectronic modules. Their advanced technology portfolio supports demanding aerospace and defense applications, utilizing advanced packaging techniques like flip-chip assembly.
Transcend Information, Inc. offers underfill as a customization option for its embedded products, enhancing reliability under high thermal or vibratory stress. This service suggests involvement in advanced electronic assembly, potentially including flip chip techniques, for robust industrial and commercial applications.
Based in Fremont, CA, AlphaEMS provides automated BGA assembly and inspection services for Silicon Valley engineers and companies. With over a decade of experience, the company specializes in advanced electronics manufacturing, supporting complex circuit board requirements.
XLR8 EMS provides high-quality and scalable electronic manufacturing services for high-performance needs. The company emphasizes speed, precision, and flexibility to meet diverse design demands. All assemblies are proudly manufactured in Southern California, supporting American jobs and innovation.
Bench provides precision microelectronics assembly services, focusing on high-reliability applications. Their capabilities include expert mixed-technology and hybrid assemblies, essential for advanced electronic manufacturing needs across various industries requiring specialized component integration and robust performance.
Hana Group Ohio specializes in microelectronic manufacturing, operating high-speed, roll-to-roll flip-chip RFID inlay lines. The company also provides IC and microelectronic assembly services, including the manufacture of microdisplays. They serve industrial and commercial B2B customers.
Based in Newark, CA, Nautech Corp specializes in comprehensive semiconductor packaging and assembly services. They provide advanced solutions including die attach, wire bonding, and flip chip assembly, alongside molding, dicing, and laser marking for various package types.
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Typical flip chip assembly yields for mature processes can reach 99.5% or higher, but this varies significantly with bump pitch, die size, and substrate complexity. Validation involves electrical test (often using daisy chains), X-ray inspection for voiding and bump integrity, and destructive physical analysis (DPA) through cross-sectioning to visually confirm interconnect quality and underfill coverage. A critical step is performing a Cpk analysis on key process parameters.
Common failure modes include non-wet opens (unconnected bumps), bridging (shorted bumps), underfill voids leading to fatigue cracks, die delamination, and warpage-induced stress. Prevention involves rigorous DFM review, precise bump deposition, controlled reflow profiles to minimize warpage, optimized underfill material selection and dispense methods, and robust quality checks like IPC-7095 guidelines for flip chip solder joint analysis.
This depends on your internal capabilities and the assembly house's expertise. If you have a trusted wafer fab with established bumping processes (e.g., UBM and solder/copper pillar deposition), providing bumped wafers can simplify the supply chain. However, many flip chip assembly houses offer integrated bumping services, which can reduce logistics, improve process control by keeping it in one vendor's hands, and allow for a more comprehensive DFM collaboration.
Underfill encapsulates the space between the flip chip die and the substrate, providing mechanical coupling and distributing stress, significantly enhancing solder joint reliability against thermal cycling and mechanical shock. Specifying the right underfill involves considering its Coefficient of Thermal Expansion (CTE) match to the solder and die, its glass transition temperature (Tg), viscosity for proper flow, and its curing profile. It's crucial to align these properties with your application's operational environment and the chosen bumping material.
Beyond electrical test, crucial inspection methods include high-resolution X-ray inspection for bump alignment, voiding in solder and underfill, and shorts/opens. Acoustic microscopy (C-SAM) is used to detect delamination between the die, underfill, and substrate. Automated Optical Inspection (AOI) verifies external visual quality and critical dimensions. For reliability testing, thermal cycling, power cycling, HAST, and highly accelerated stress tests are standard.
Substrate choice is paramount for flip chip reliability, directly impacting thermal management, electrical performance, and mechanical stability. Key considerations include the substrate's CTE, flatness, warpage characteristics, material composition (e.g., organic laminates, ceramic, silicon interposers), and the plating quality of its pads. A mismatch in CTE between the die, bumps, and substrate can lead to significant stress and early failure. Discussing your application's thermal budget and power dissipation with the assembly partner is critical.