Die Bonding Companies

Advanced Microsystems Technologies, a Sanmina division, specializes in advanced microelectronic packaging services. They offer design and manufacturing for custom die, modules, heterogeneous integration, and next-generation chiplet technology. The company provides comprehensive solutions for microelectronic and optical assembly, helping technology firms accelerate innovation and production.

Based in Tempe, AZ, Amkor Technology provides advanced outsourced semiconductor assembly and test (OSAT) solutions. The company offers comprehensive semiconductor packaging and test services for global chip manufacturers, supporting a wide range of integrated circuit applications.

AmTECH Microelectronics, based in Morgan Hill, CA, offers custom microelectronics assembly and packaging services. They specialize in die bonding, flip chip bonding, and wire bonding, alongside vacuum reflow and SMT. With 30+ years experience, AmTECH supports prototype to production for defense, aerospace, and medical clients.

Based in Burnsville, MN, Analog Technologies offers contract manufacturing for electronic PCB assemblies. Specializing in low volume/high mix, high reliability, and complex applications, they provide advanced packaging and wire bonding. Markets include aerospace, military, medical, and industrial instrumentation, supporting prototypes and full production.

AOP Technologies provides contract manufacturing of sub-assemblies and industrial automation solutions for semiconductor and other manufacturers. They offer mechanical engineering, machining, 3D printing, and kitting services from their Auburn, WA facility.

Located in Milpitas, CA, Asteelflash is a specialist Electronics Manufacturing Services (EMS) company and contract manufacturer. They deliver high-end engineering and manufacturing services, offering comprehensive PCB assembly, design, prototyping, and production solutions for diverse industries from initial concept to mass-production.

Based in Santa Barbara, CA, Atomica offers advanced microfabrication services for rapid prototyping and scalable production. They specialize in complex layer integration and materials, with capabilities including wafer bonding. Atomica enables hermetic and vacuum wafer-level packaging, reducing costs for post-process die-level packaging in photonics, sensors, and MEMS applications.

Based in Lakeville, MN, Automated Assembly Corporation specializes in roll-to-roll SMT flexible assembly, including die bonding. They perform flip chip die bonding using solder or wire bonding for various substrates. Services also include flexible circuit prototyping and design for manufacturability.

Based in Santa Ana, CA, PARPRO Technologies, formerly Cal Quality Electronics, is an Electronics Manufacturing Services (EMS) supplier. The company provides PCBA, cable assembly, and full system integration, specializing in high-speed placement of 01005 components, Micro BGAs, and PoP technologies, which typically involve advanced die bonding processes. They are ISO and ITAR certified.

Cascade Systems Technology, based in Hillsboro, OR, provides electronic contract manufacturing and microelectronics assembly. Capabilities include precise die placement, epoxy dispense and cure, and wire bonding (ball and wedge). They serve diverse industries such as AI/data centers, military/aerospace, medical devices, and semiconductor manufacturing.

Engent, based in Norcross, GA, provides advanced microelectronics assembly and electronic manufacturing services. Leveraging advanced technologies and unique wiring within its world-class facilities, the company supports sophisticated clients. Engent offers solutions that shorten product time-to-market and enable high-volume manufacturing for next-generation electronic devices.

Based in Newburyport, MA, Electronic Products Inc. (EPI) manufactures high-quality, vertically integrated microelectronic hermetic packages. The company specializes in advanced ceramic and glass-to-metal sealing for diverse applications including medical, imaging, military, aerospace, satellite, and industrial sensors.

Based in Fremont, CA, Golden Altos Corporation provides specialized semiconductor assembly services. The company focuses on high-speed, fine-pitch wire bonding, offering a standard variety of wire types and diameters. Their comprehensive capabilities extend to assembly qualification and program management for advanced electronic components.

Hana Micro is a global manufacturing service provider specializing in microelectronics assembly and IC packaging. Their services include SMT placement, PCB assembly, and camera modules, with expertise in stacked die packaging. They serve leading industries such as automotive, healthcare, consumer electronics, industrial, and telecom.

Based in San Marcos, CA, Hughes Circuits Inc. is a fully integrated electronics manufacturing service (EMS) provider. The company offers PCB design, fabrication, and full-service advanced microelectronics assembly. They also provide precision metal fabrication, focusing on high-reliability markets such as military, medical, and high-speed/RF applications.

Based in Peabody, MA, Innovent Technologies provides comprehensive semiconductor contract manufacturing services. The company specializes in delivering integrated solutions for chip assembly and packaging, which typically includes advanced die bonding processes. They support various stages of semiconductor production for their clients.

Based in Westbrook, ME, Lancointegrated provides integrated micro-system assembly, test, and inspection services. They specialize in precision die attach (die bonding), wire bonding, and flip chip assembly for complex electromechanical and optical components, serving advanced technology sectors including MEMS, sensors, and semiconductors.

Based in Sunnyvale, CA, MEMS Engineering and Material Inc. specializes in fabricating SOI wafers, customized bonding structures, and silicon wafers. They leverage proprietary technology to supply SOI wafers with ultra uniform device and ultra low stress. The company offers comprehensive specifications for device and buried oxide layers, including Silicon-On-Glass and debondable options.

Based in Centennial, CO, Micross provides advanced microelectronic assembly services. The company utilizes automated, state-of-the-art die attach, wire bond, encapsulation, and CSP capabilities to offer competitive solutions. Micross supports a broad range of industries with its specialized die bonding and packaging expertise.

Based in Milledgeville, GA, Mirror Semi offers die attach and wirebond assembly services for open cavity QFN semiconductor packages. They support MEMS, RF, sensor, and silicon applications, specializing in engineering and rapid prototypes. The company also supplies various bonding wires and QFN package components.

Based in Rochester, NY, Mosaic Microsystems is a microelectronics and photonics packaging company. It specializes in enabling thin glass substrates using its proprietary VIAFFIRM® bond for demanding next-generation packaging needs. The company provides custom through-glass vias and metallized thin glass wafers for various advanced applications.

Northrop Grumman, a U.S. aerospace and defense technology company, strengthens domestic semiconductor manufacturing. They develop and implement unique packaging and stacking techniques for microelectronics, including hardening solutions for harsh environments like spacecraft. The company leverages these advanced capabilities for defense innovation.

NPI Services provides expertise in wire bonding and die attach processes for microelectronics assembly. They leverage advanced tools and machinery to ensure the strength and reliability of bonds, supported by comprehensive testing procedures. Their services focus on delivering robust and dependable interconnect solutions.

Peko Precision Products is a vertically integrated contract manufacturer specializing in complex electromechanical machinery, equipment, and precision assemblies. They provide full-service contract manufacturing, including complex and precision assembly for the semiconductor, medical, and defense industries. Their expertise also covers custom machine building and sheet metal fabrication.

Based in Bloomington, MN, Polar Semiconductor, LLC is an American manufacturer of high-voltage semiconductors for extreme applications. The company’s integrated manufacturing operations perform essential processes like die bonding, crucial for packaging and ensuring the robust performance of its semiconductor devices.

Based in Santa Clara, CA, Promex Industries is a contract manufacturer specializing in complex microelectronics assembly and precision packaging. They provide integrated services from wafer processing and die prep to SMT and final box build, supporting heterogeneous integration.

Based in Corona, CA, PVA TePla America operates as a contract service house specializing in diffusion bonding joining. Leveraging expertise in semiconductor equipment and plasma systems, the company provides high-performance heat treatment and surface cleaning services, supporting critical applications in advanced materials and semiconductor packaging.

Sanmina Corporation provides integrated design and manufacturing services, specializing in optical, RF, and microelectronic solutions for high-technology OEMs. The company offers advanced manufacturing for cloud and AI capabilities, including data center infrastructure, serving various industries with complex electronics production.

S&C Micro, based in Livermore, CA, specializes in micro system integration, providing precision wire bonding, die attach, and flip chip attach services. They offer quick turn prototypes and advanced packaging solutions, utilizing various bonding techniques like eutectic and thermo compression. S&C Micro is ITAR Registered and US based.

Based in San Jose, CA, SemiGen is an RF and Microwave manufacturer offering end-to-end services. They provide design, engineering, and contract assembly, alongside high frequency testing, to bolster customer supply chains. SemiGen partners with clients to bring products to life, focusing on comprehensive manufacturing solutions.

Based in San Jose, CA, Silitronics specializes in advanced semiconductor and photonics packaging solutions. They provide high-precision optical alignment, multi-chiplet SiP, and heterogeneous integration for AI, HPC, and 6G networks. Services include onshore wafer processing (thinning, polishing, dicing), and advanced flipchip substrate fabrication.

Based in Elyria, OH, SMART Microsystems Manufacturing Services specializes in full-service microelectronic assembly and sub-assembly manufacturing. They offer custom process development, along with in-house test and inspection capabilities. As part of the semiconductor supply chain, SMART Microsystems supports the development and production of next-generation microelectronic products.

Based in Fremont, CA, Sonic Manufacturing Technologies offers a complete range of electronic manufacturing services. From new product introduction to supply chain management, they ensure top-quality and efficient production for diverse electronic needs, encompassing advanced assembly processes.

Stellant Systems manufactures advanced electron devices, serving high-reliability markets including space, defense, medical & scientific, and industrial sectors. An AS9100D certified and ISO-9001 accredited facility, Stellant performs complex electronics assembly, which includes in-house die bonding capabilities for their specialized components and systems.

Based in Madison, AL, STI Electronics, Inc. specializes in state-of-the-art microelectronics packaging design and assembly. Their microelectronics lab provides die bonding and other critical services for advanced electronic applications from facilities in Alabama and Texas. They also offer industry-standard training and certifications.

StratEdge specializes in high-performance ceramic packages for GaN, GaAs, and SiC devices. The company offers direct die and passive component attach services, alongside automatic wire bonding for microelectronics packaging innovation. StratEdge serves critical sectors including defense, satellite, test & measurement, automotive, and downhole applications.

Based in Anaheim, CA, Technotronix offers electronics manufacturing services. They specialize in high-quality PCB assembly, including surface mount and chip on board (COB) technologies, which encompasses die bonding. Services also include electro-mechanical assembly, box builds, and testing for various industries.

Based in Houston, TX, Texas Microelectronics Corporation provides microelectronic engineering, design, and manufacturing services. Their capabilities include die-level programming, packaging, assembly, and wirebonding, supporting solutions for DSP/ASIC hybrids, MCMs, and DC-DC converters for various applications.

Based in Sherman, TX, Texas Instruments provides bare die and wafer services, enabling size and weight reduction and enhanced function integration for various electronic systems. The company specializes in manufacturing integrated circuits, continually pioneering advances to make semiconductors more efficient and affordable across numerous applications.

USsemi Inc. specializes in advanced semiconductor packaging solutions, including 2D wafer-level packaging and 2.5D interposer/Si technologies. Based in Williamsburg, VA, the company provides critical services for integrated circuit assembly. Their expertise supports the development and production of high-performance semiconductor devices for various industries.

Based in San Jose, CA, Applied Engineering, Inc. is a high-tech contract assembly manufacturer. They provide turnkey and custom manufacturing solutions, including complex sub-assemblies and clean room assembly, for product development OEM companies. The company serves semiconductor, medical device, life science, clean energy, and robotics industries.

Spectra-Tech Manufacturing Inc. provides high-quality Electronic Manufacturing Services (EMS) from its facility in Batavia, Ohio. The company specializes in comprehensive solutions, including PCB manufacturing and advanced PCB assembly, handling all components for diverse client needs.

Based in Liverpool, NY, American Dicing, Inc. provides precision wafer dicing, scribing, die mounting, bonding, wire bonding, and packaging services. The company works with wafers up to 12 inches in a Class 10,000 clean room, serving military, aerospace, medical, and commercial electronics industries.

American Semiconductor, Inc. based in Boise, ID, develops and manufactures ultra-thin electronics technology. The company provides advanced chip packaging, assembly, and test services, encompassing die bonding processes. Offering comprehensive solutions from design to full assembly, they serve the semiconductor industry with integrated manufacturing capabilities.

Die Bond LLC specializes in joining split-layer injection molding dies. Their process integrates complex conformal cooling passages directly into the dies, significantly speeding up production time for manufacturers. This unique die bonding technique enhances efficiency and performance for high-precision molding applications.

Hybond specializes in providing wire and die bonding services for semiconductor manufacturers. The company develops die bonding tools and specialized solutions, including Soft-Touch™ bonding technology, which facilitates bonding in hard-to-reach places and reduces damage to sensitive materials for diverse applications.

Based in Lake Oswego, OR, Integense Microelectronics specializes in end-to-end semiconductor development. The company provides comprehensive solutions covering definition, design, fabrication, packaging, and test. Leveraging proprietary silicon process technology and materials engineering, Integense delivers optimal analog and mixed-signal circuit designs for high-volume industrial and consumer applications.

Based in Salem, NH, Micro Precision Technologies (MPT) specializes in die attachment and wire bonding services. They offer manual and automated die attach, ball and wedge bonding, and auto dispense capabilities. MPT provides semiconductor packaging for high temperature electronics, power semiconductors, and prototype die applications.

Microsembly provides expert eutectic and epoxy die attach services, delivering void-free, high-performance bonds with precision process control. The company specializes in advanced RF microwave assembly solutions for aerospace, defense, space, medical, and commercial markets.

NEOTech delivers comprehensive electronics manufacturing solutions for advanced technology OEMs. The company specializes in developing and building high-frequency, high-speed electronics, tailored for challenging environments across aerospace & defense, high-tech industrial, and medical equipment sectors. They support critical applications requiring robust manufacturing expertise.

Based in Rockford, MI, Polymer Assembly Technology (PAT) offers precision proto-type and low-volume flip chip assembly services. Their proprietary stencil printing technique uses low-temperature curing, silver-filled conductive epoxies. This provides an alternative to conventional indium bump bonding for fine-pitch pixel imaging and sensitive II-VI/III-V devices.

QP Technologies provides prototype and small-volume IC packaging and assembly services, specializing in full turn-key solutions. The company offers enhanced Flip Chip bonding capabilities and is certified to ISO 9001, ISO 13485, ANSI/ESD S20.20, and AS9100D for high-reliability applications.

Semicorp specializes in advanced semiconductor die preparation, crucial for effective die bonding. They utilize techniques like gold bumping, electroplating, deposition, and stud bumping to create electrical connections on dies. These processes ensure reliable and high-performance attachment of semiconductor components to their final packages.

SEMPAC specializes in the development and manufacturing of integrated packaging solutions, crucial for advanced semiconductor applications. The company utilizes manufacturing processes that adhere to strict RoHS and REACH material compliance standards. They provide comprehensive packaging expertise, serving clients within industries requiring critical die bonding capabilities as part of their integrated solutions.

Sensience manufactures highly engineered sensing and sealing components, alongside customized hermetic packages for high-frequency and fiber optic electronics. Their offerings include feedthroughs and press-on connectors. This focus on advanced electronic packaging and component assembly implies direct capabilities in die bonding processes for various industrial applications.

Kyocera Americas manufactures advanced hermetic packages for demanding electrical and thermal environments, serving critical applications like down-hole drilling and space. The company employs sophisticated manufacturing processes, including precision die bonding, to produce robust electronic packaging solutions for B2B customers.

Bench, a subsidiary of TTM Technologies, specializes in advanced microelectronics manufacturing and hybrid assembly solutions. Based in Stafford Springs, CT, the company directly provides die bonding services alongside wire bonding and flip chip capabilities for high-reliability applications in defense, aerospace, medical, and industrial markets.

GlobalFoundries is a leading global semiconductor foundry specializing in the manufacturing of essential chips for diverse industries like AI, automotive, and aerospace. The company offers advanced packaging and test capabilities for US-made chips, expanding its portfolio with silicon photonics and GaN technology.

GPR Company, based in San Jose, CA, is a contract manufacturer providing advanced semiconductor assembly services. They specialize in comprehensive manufacturing solutions for the semiconductor equipment industry, including various die attach (die bonding) processes such as flip-chip, epoxy, and solder die attach.

Hana Group Ohio specializes in microelectronic assembly, including the manufacture of microdisplays and high-speed, roll-to-roll flip-chip RFID inlay lines. The company provides comprehensive integrated circuit and microelectronic assembly services for various applications.

NHanced Semiconductors transforms bleeding-edge designs into state-of-the-art 3DICs and 2.5D assemblies by integrating dies and chiplets. As the USA’s first pure-play advanced packaging foundry, it provides comprehensive solutions from prototype to production, including multi-die/chiplet design, sourcing, advanced packaging, and package assembly.