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Last updated: January 2026
This directory lists 43 ceramic PCB manufacturers across the United States, from specialized High-Temperature Co-fired Ceramic (HTCC) providers to innovative thin-film process houses focusing on precision RF applications.
Buyers typically engage ceramic PCB manufacturers to solve critical problems related to thermal management, high-frequency performance, and harsh environment survivability. This often involves designing substrates for high power density modules where passive cooling isn't sufficient, ensuring signal integrity in mmWave applications with tightly controlled impedance, or fabricating hermetic packages requiring exceptional mechanical stability and minimal outgassing. The choice between materials like alumina, AlN, or even silicon carbide, along with the appropriate metallization—be it tungsten for HTCC or gold for thin film—directly impacts these performance metrics.
The ecosystem of ceramic PCB manufacturers is diverse, encompassing various specializations. Some excel in high-volume, cost-effective thick-film hybrid circuits on alumina for industrial controls, while others are pioneers in complex multi-layer LTCC structures for advanced defense or medical implants. You'll also find specialists in Direct Bonded Copper (DBC) for power electronics, who focus heavily on optimizing the copper-to-ceramic bond layer for maximum thermal cycling reliability. Their core competencies, from material handling and firing profiles to post-processing like laser machining and plating, dictate their ideal project fit.
Before approaching ceramic PCB manufacturers, buyers should have a clear understanding of their application's thermal budget, electrical performance targets (e.g., characteristic impedance, insertion loss at frequency), and environmental operating conditions. Suppliers expect detailed CAD files, material specifications, and preferably a preliminary stack-up design, especially for multi-layer constructs. Being able to articulate specific reliability requirements, such as thermal shock cycles or vibration resistance, allows manufacturers to propose the most suitable ceramic material, metallization, and fabrication process, helping to avoid costly redesigns down the line.
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43 companies nationwide
Based in San Marcos, CA, Accu-Tech Laser Processing specializes in laser machining, drilling, and scribing/scoring services for ceramic substrates and PCBs. With over 30 years of experience, they provide quick prototype delivery and volume processing for aerospace, defense, medical, and commercial sectors.
Centerline Technology manufactures high-purity ceramic materials and custom machined ceramic components. They specialize in Beryllium Oxide (BeO), Alumina, and Aluminum Nitride substrates. These materials are crucial for high-power microwave circuits, RF applications, and advanced thermal management in electronics, directly supporting ceramic PCB fabrication.
Based in St. Albans, VT, STC Material Solutions is a manufacturer of highly engineered advanced materials. The company specializes in technical ceramics, hermetic sealing, and joining of dissimilar materials. They produce electrical feedthroughs, opto-electronic windows, and ceramic-to-metal seals, bonds, and packages for mission-critical applications.
Based in Santa Ana, CA, Complete Hermetics specializes in manufacturing customized hermetic seals, feedthroughs, and electronic packages. The company provides Ceramic PCB manufacturing, ceramic metallizations, and laser scribe/cutting on ceramic substrates. They serve the defense, energy, aerospace, communications, and transportation industries.
Based in Saxonburg, PA, Du-Co Ceramics Company is a fully integrated manufacturer of precision technical ceramic components. They produce 96% alumina substrates, suitable for ceramic PCB applications, offering custom laser cut designs. Their capabilities include dry pressing, extrusion, secondary machining, glazing, and grinding across various ceramic materials.
Based in Bedford, MA, Epec specializes in manufacturing high-performance printed circuit boards for demanding Microwave and RF applications. They utilize advanced laminates with superior electrical, thermal, and mechanical characteristics beyond standard FR-4. Epec provides custom PCB solutions with convenient online quoting and ordering services.
EPI Hermetics, based in Newburyport, MA, manufactures customized ceramic seals, feedthroughs, and microelectronic packages utilizing high-temperature cofired ceramics (HTCC) technology. They provide advanced hermetic packaging for diverse applications, including medical, imaging, military, aerospace, satellite, and industrial sectors.
Based in Parkland, Florida, ETICeramics specializes in manufacturing custom silicon nitride substrates. These high-performance ceramic components are engineered for next-generation power modules, providing superior thermal management and structural integrity for advanced electronic applications.
Based in Bedford, NH, Ferrotec is a global manufacturer of advanced technology solutions and materials. The company specializes in Direct Bond Copper (DBC) and Active Metal Brazed (AMB) ceramic substrates, offering high-purity advanced ceramic materials and components primarily for power electronics applications.
Based in Milpitas, CA, Fralock Companies fabricates low temperature co-fired ceramic (LTCC) components using Ferro and DuPont systems. They specialize in multi-layer aluminum nitride (AlN) heaters with complex tungsten circuitry and integrated temperature sensing. Fralock serves high-reliability applications in semiconductor, aerospace, medical, and industrial sectors.
Heraeus Electronics is a global manufacturer of advanced electronic materials and components. The company produces Metal Ceramic Substrates and Die Top Systems for electronics assembly and packaging. They develop material solutions for automotive, power electronics, and advanced semiconductor packaging markets, with facilities in the USA.
Based in St. Petersburg, FL, HT Global Circuits, LLC specializes in manufacturing high-reliability flex and ceramic PCBs. With over 35 years of experience, they produce compact circuit boards for implantable medical electronics, adhering to FDA-safe materials and tight bio-compatibility standards. They offer competitive small to medium volume production.
Based in Clarksburg, NJ, Hybrid-Tek, LLC is a manufacturer specializing in thick film circuit manufacturing, hybrid PCBs, and ceramic boards. They offer wire bonding services and custom design for industrial applications. The AS9100 registered and ITAR compliant company provides R&D expertise for product development.
Meritronics provides turnkey PCB assembly and electronics design services, with a specific focus on ceramic applications. The company emphasizes cost-effective solutions and high-quality production for various electronic projects, serving industrial and commercial B2B customers.
Based in Centennial, CO, Micross specializes in designing and producing custom hermetic devices. The company addresses hi-reliability requirements and provides custom ceramic-packaging solutions for advanced electronic applications, delivering specialized manufacturing services.
Based in Milpitas, CA, PCB Trace specializes in manufacturing ceramic PCBs. The company provides advanced ceramic circuit boards for medical devices, meeting requirements for high thermal conductivity and a low coefficient of thermal expansion.
Based in Clackamas, OR, PCBYou specializes in manufacturing ceramic PCBs. They provide comprehensive services, utilizing advanced processes like sintering and high-temperature firing of ceramic substrates. This ensures permanent adhesion and enhanced material properties for high-quality ceramic printed circuit boards, suitable for diverse electronic uses.
PICA manufactures ceramic PCBs with high thermal conductivity and reliability. They also produce flexible, rigid-flex, metal core, and standard PCBs. The company provides engineer-driven solutions from design to delivery, serving industries such as aerospace, medical, automotive, and power electronics.
Precise Ceramic, based in Lake Forest, CA, manufactures ceramic circuit boards designed for high-temperature applications. These boards provide excellent electrical insulation and mechanical strength, catering to demanding industrial requirements. The company specializes in precision ceramic components, offering robust solutions for advanced electronic systems.
Promex Industries, based in Santa Clara, CA, is a contract manufacturer for complex microelectronic devices. They specialize in U.S.-based substrate fabrication, including wafer processing, SMT, and microelectronics assembly. Offering integrated manufacturing workflows and flexible engineering support, Promex guides clients from prototype to full production.
Based in San Jose, CA, PTC is a US company specializing in the microelectronic-ceramic industry. It manufactures multilayer ceramic components, directly serving as a provider for ceramic PCB solutions. PTC also offers expertise in multi-chip modules for high-performance electronic applications.
Based in Norwood, MA, Remtec designs and manufactures advanced ceramic circuits and substrates using proprietary Plated Copper Thick Film (PCTF®) technology. They plate copper images over thick film on ceramic, producing metallized substrates, chip carriers, and SMT packages. The company serves high-power, heavy circuit density electronics applications.
Rush Flex PCB manufactures flexible and rigid-flex PCBs in the USA for prototype and large-volume production, utilizing custom tools. The company also offers ceramic printed circuit boards, high-density interconnect (HDI), and metal core PCBs. They provide comprehensive services, including design, engineering, and 24-hour technical support.
Based in Milpitas, CA, Rush PCB is a direct manufacturer specializing in Ceramic PCBs. They produce printed circuit boards known for excellent electrical insulation and high thermal conductivity, catering to various industrial and commercial applications. As a US-based company, Rush PCB provides comprehensive PCB fabrication services.
Based in San Jose, CA, Sanmina Corporation manufactures advanced printed circuit boards for critical applications. The company provides comprehensive PCB solutions for sectors including defense, aerospace, and medical, and also manufactures data center infrastructure for cloud and AI capabilities.
Based in Chino, CA, Sierra Assembly Technology LLC specializes in PCB assembly and production services. The company manufactures high-frequency Rogers PCBs, utilizing advanced materials for high-speed performance. With over 30 years of experience, they offer quick turn PCB assembly and prototyping, catering to industries such as defense and healthcare.
Based in Marlborough, MA, Spectrum Control specializes in screen printing multi-layer thick-film hybrid interconnects on ceramic substrates for advanced electromagnetic spectrum control. The company provides engineering, design, and manufacturing services from concept to production, serving Aerospace + Defense and commercial sectors.
StratEdge specializes in high-performance molded and post-fired ceramic packages for demanding microelectronics. They engineer solutions for GaN, GaAs, and SiC devices across various industries, including defense, satellite, test & measurement, automotive, and high-power RF applications.
Based in McKinney, TX, Thick Film Solutions designs and manufactures high-quality thick film substrates and hybrids. They produce products to MIL-PRF-38534 visual criteria, working from customer schematics or existing prints. The company serves industrial, medical, military, and aerospace markets, handling prototypes to full production volumes.
UnityPCB specializes in cutting-edge ceramic PCB manufacturing for extreme environments, focusing on thermal performance, reliability, and precision. The company offers elite PCB design and comprehensive assembly services, managing component sourcing to final product with stringent quality control.
US Technical Ceramics, Inc. specializes in manufacturing high-purity alumina structural ceramics, offering various grades from 98.0% to 99.9%. Their ceramic bodies are well-suited for demanding applications including insulators, metallized components, and microwave applications, making them a key supplier for ceramic PCB manufacturing.
Based in Chattanooga, TN, AdTech Ceramics manufactures co-fired ceramic electronic packages for mission-critical applications. The company specializes in high-temperature co-fired ceramic (HTCC) and multi-layer aluminum nitride (AlN) solutions. They engineer strong, durable, and precise ceramics for challenging environments, ensuring quality components for complex systems.
Cofan USA Inc. specializes in providing thermal solutions, including Aluminum Nitride (AlN) PCBs, a type of ceramic PCB, for high-power applications. Based in San Bruno, CA, the company manufactures and sells these ceramic-based PCBs known for their high thermal conductivity and reliable performance.
Venture Manufacturing Inc. based in Bolingbrook, IL, is a specialized manufacturer of Thick Film Ceramic PCBs, employing new materials for high-performance applications. The company also offers comprehensive manufacturing services for various other PCB types, including high-frequency, rigid, and flexible circuits.
CoorsTek, headquartered in Golden, CO, specializes in manufacturing advanced technical ceramic components and substrates. The company provides a range of ceramic materials, metallization, and hermetic packaging services for critical electronic applications, including components vital for ceramic PCBs.
Elcon Precision LLC specializes in manufacturing electronic packages and assemblies using high thermal conductivity ceramics like beryllium oxide and aluminum nitride. The company offers ceramic-to-metal joining, ceramic metallization, and brazed assemblies. They serve aerospace, medical, and defense industries with mission-critical components.
Based in Camarillo, CA, Johanson Technology provides a specialized foundry service for custom Low-Temperature Co-fired Ceramic (LTCC) based products. They enable the design and manufacturing of ceramic substrates and circuits using their established design rules, catering to high-performance applications.
Based in Mayfield Heights, OH, Materion manufactures ceramic packages designed for RF and microwave transistors, known for very low thermal resistance. The company provides innovative material solutions that enable advanced technologies, supporting applications in areas such as next-generation AI and space exploration.
Based in Salem, NH, Micro-Precision Technologies, Inc. specializes in thick film substrates for high-temperature electronics and power semiconductor packaging. They provide FR4 conversions, hybrid assembly, die attachment, and wire bonding, catering to advanced electronic circuit manufacturing.
NEOTech specializes in manufacturing high-quality LTCC and HTCC ceramic substrates, providing advanced electronics manufacturing solutions. With over 40 years of experience, the company serves advanced technology OEMs in high-tech industrial, aerospace & defense, and medical equipment sectors.
Based in Wooster, OH, RBB Systems manufactures circuit boards using a variety of substrate materials. Their capabilities include standard PCB/PWB, flex circuit, metallic, and ceramic substrates. They also specialize in manufacturing mixed rigid/flex substrates for diverse applications.
AMETEK Aegis manufactures hermetic glass to metal seal microelectronic packages. The company specializes in custom electronic packaging with glass and ceramic configurations, including HTCC feedthroughs and highly customized packages. It serves the defense sector, providing components for high reliability, mission-critical applications.
LTCC Lab manufactures Low Temperature Co-fired Ceramic (LTCC) systems, multi-layer substrates, and LTCC PCBs. They offer prototyping and advanced ceramic packaging for high-frequency devices. Services cater to wireless, telecommunication, microwave, automotive, and general electronics applications, including components like antenna modules and power amplifiers.
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HTCC (High-Temperature Co-fired Ceramic) PCBs offer superior mechanical strength and hermeticity, using refractory metals like tungsten or molybdenum, making them ideal for high-power, high-frequency, and extreme temperature environments. However, their high firing temperatures limit the use of low-resistivity conductors. LTCC (Low-Temperature Co-fired Ceramic) PCBs, fired at lower temperatures, allow for high-conductivity metals like silver and gold, enabling complex multi-layer structures, integrated passive components, and better RF performance. The trade-off often lies in mechanical robustness versus electrical performance and design flexibility; HTCC is rugged, LTCC is more integrated and RF-friendly.
CTE matching is extremely critical, especially for power devices, BGAs, or large dies, because a significant mismatch between the ceramic substrate and the attached component during thermal cycling can induce mechanical stress, leading to solder joint fatigue, delamination, or component failure. Manufacturers address this by selecting ceramic materials (e.g., Alumina, AlN, or even custom formulations) whose CTE closely aligns with the components, or by using specific metallization layers (like compliant DBC layers) and bonding methods designed to absorb stress. Robust DFM analysis and extensive thermal cycling tests are also key to validating reliability.
You should consider DBC when your application demands extremely high thermal conductivity, high current carrying capability, and superior thermal cycling reliability, typically for power modules, IGBTs, or LED arrays. DBC offers a pure copper layer directly bonded to the ceramic (usually Alumina or AlN) without an adhesive, providing excellent heat transfer and a robust electrical path. Traditional thick-film or thin-film processes, while versatile, have thinner metallization and sometimes higher thermal resistance at the interface compared to DBC, making DBC the preferred choice for applications where every degree of thermal management and every amp of current matters.
Several parameters are unique to ceramic PCBs. Foremost is the selection of the ceramic substrate material itself (e.g., dielectric constant, loss tangent, thermal conductivity). Also critical are via aspect ratios and diameters, especially for stacked or filled vias in multi-layer LTCC, as these directly impact manufacturability and reliability. Metallization adhesion and thickness, often involving specific refractory metals or plating processes, are also paramount. Designers must also consider post-firing processes like laser machining for precise feature definition, or the effects of camber/warpage across larger substrates, which necessitate close DFM collaboration to optimize layout for process yields and cost-effectiveness.